Who we build for
Built for the people holding the ramp.
Advanced-packaging manufacturers running flip-chip, 2.5D and CoWoS-class, HBM stacking, fan-out and panel-level and hybrid bonding for AI accelerators, HBM, HPC, mobile and automotive.
Profile
What a good fit looks like
Revenue between roughly $500M and $100B. Enough package volume and package value that a single point of yield is unambiguously material. Existing bonders, molding tools, X-ray, SAM and AOI systems, test cells and an MES — with SECS-GEM or API access, and an organisation willing to grant it.
Above all: an executive mandate. Not curiosity about AI, but a specific instruction to raise yield, accelerate a ramp, or cut warpage and void scrap on a package that matters — and the authority to sign a pilot success metric against it.
- High-value AI accelerator, HBM or HPC package families
- Tool access under strict IP and security controls
- A named process or yield engineer who will own the pilot
- Willingness to be measured, in writing, before we install anything
The committee
Three roles, three arguments
Economic buyer
Packaging fab / manufacturing operations director
Owns yield, ramp, throughput and cost. Judges us on hard ROI in a paid pilot, and on whether we integrate with the systems of record they already depend on.
- Frustration: warpage and void scrap on high-value packages
- Frustration: quarter-long ramps of manual tuning
- Objection: change management and integration effort
- Wins on: a signed metric, met
Champion
Process integration / yield engineer
Owns bonding, stacking and molding process, defect reduction and yield ramp. Judges us on whether the agent’s calls survive contact with their own judgement.
- Frustration: recipe drift and constant firefighting
- Frustration: no real-time cross-tool visibility
- Objection: trust and accuracy
- Wins on: grounded output they can check
Approver
Quality / reliability engineer, IT/OT and IP
Owns warpage and void quality, package reliability, binning and field returns — plus the security and IP posture that governs whether any of it may happen.
- Frustration: escapes that fail in the field
- Objection: yield and IP risk
- Objection: who can write to which tool
- Wins on: audit, isolation and revocable autonomy
Pain, by stakeholder
What we hear in the first meeting
- 01 Warpage and void scrap
High-value packages carrying already-expensive known-good die, lost to a failure mode that was forming three steps earlier.
- 02 Sub-micron hybrid-bond misalignment
Alignment drift and particle defects killing bonds on the process everyone is betting the next node on.
- 03 Cracked dies and delamination
Die cracks, bump bridging and co-planarity faults and delamination on stacked die — often discovered after the stack is complete.
- 04 Low, slow-ramping yields
New 2.5D, 3D, HBM and hybrid-bonding lines that ramp over quarters while the capacity is desperately needed now.
- 05 CoWoS-class capacity gating
Being the bottleneck of the entire AI buildout, where every yield point converts directly into accelerators that do or do not ship.
- 06 The engineer shortage
A severe, structural shortage of packaging process and yield engineers — and the craft leaving the building with each retirement.
In their words
Three conversations we keep having
Operations directorOSAT, advanced packagingWe are not short of data. We are short of the two people who can interpret it.
Process integration leadIDM back-endEvery new package costs us a quarter of tuning we cannot get back.
Reliability engineerAutomotive-grade packagingThe escape that scares me is the one that passes final test.
Composite drawn from design-partner and industry conversations. Illustrative, not a customer endorsement.
Anti-profile
Who we will tell to wait
Selling into a bad fit costs both sides a year.
- R&D or pilot lines only
- Without volume production there is no baseline to beat and no economics to prove. Come back when the line is running.
- No tool integration possible
- If IP or security constraints mean nothing can be read and nothing written back, the majority of the value is structurally unavailable.
- Looking for a dashboard
- If the requirement is a horizontal visualisation layer over existing data, there are cheaper, better products for that. Chipira is a system of action.
- No named owner
- A pilot without a process or yield engineer who owns it produces an inconclusive result and a bad experience for everyone.
Connector coverage across the back end
- ASMPT
- BESI
- Kulicke & Soffa
- EV Group
- SUSS MicroTec
- TOWA
- Nordson
- Camtek
- Onto Innovation
- Advantest
- Teradyne
- Cohu
Vendor-neutral integration over SECS-GEM, tool APIs and OT interfaces. Vendors listed are integration targets for the connector library and are not endorsements or commercial partnerships.
Segment
The market we serve
- $30B Advanced-packaging automation, process control, inspection, test, MES and fab software.
- $7.5B The serviceable segment for autonomous control, packaging vision, yield optimisation and twins.
- $440M Three-year obtainable share Chipira is building toward.
- $500M–$100B Revenue band of the manufacturers in our ideal customer profile.
Chipira’s internal market estimates [ASPIRATIONAL], derived from public equipment, inspection, test and fab-software segment data.
Fit questions
Before you get in touch
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Yes — the qualification takes twenty minutes and we will tell you honestly. Volume matters less than package value; a lower-volume line running very high-value packages is often a better fit than a high-volume commodity line.
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That is the normal case and, frankly, the reason we exist. A single-vendor line has more options; a six-vendor line has almost none, because no incumbent will unify tools it does not sell.
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Alongside it, and reading from it. A yield management system tells you what happened. Chipira acts on the process that produced it, and writes the outcome back so your YMS gets better inputs.
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Yes. Shadow mode is perception-only by definition, and many organisations run for months there. You will get real value from perception alone — but the compounding starts when the loop closes.
Start narrow, expand relentlessly
Land one workflow. Own the loop.
A Chipira engagement begins with a single wedge workflow, a shadow-mode baseline and one signed success metric. Everything after that is expansion.